Fujifilm to Showcase Cutting-Edge Back-End Process Materials at “ECTC 2025”

TOKYO, May 20, 2025 – FUJIFILM Corporation today announced that its U.S.-based subsidiary for semiconductor materials, FUJIFILM Electronic Materials U.S.A., Inc. (Fujifilm), will participate in the international conference on semiconductor back-end technologies, “The Electronic Components and Technology Conference 2025” (hereafter referred to as “ECTC 2025”). ECTC 2025 will be held in Dallas, Texas, USA, over a four-day period starting on May 27, 2025.

“ECTC 2025” is the world's largest international event in the field of semiconductor back-end manufacturing, including packaging. The conference will feature exhibits from over 100 semiconductor-related companies and will bring together more than 2,000 scientists, engineers, and business professionals from over 20 countries. The technical program of this conference will include presentations on cutting-edge packaging technologies designed to meet the demands of miniaturization and multilayering for next-generation semiconductors, which are expected to see increased demand in AI servers.

At this conference, Fujifilm will showcase its range of existing polyimide materials for protective coating and redistribution layer (RDL) insulation used in back-end processes, as well as film-type interlayer insulation materials, introduced at Semicon Japan last year. Also displayed will be the company’s advanced heat dissipation materials sheets that contribute to energy efficiency, along with materials evolved from its CMP slurry, including its solution for copper wiring which holds the top global market share in its category.

Fujifilm is a global supplier of photoresists^*1, photolithography-related materials^*2, CMP slurries^*3, post-CMP cleaners^*4, thin-film chemicals^*5, polyimides^*6, high-purity process chemicals^*7, and other process materials for semiconductor manufacturing from front-end to back-end processes. Fujifilm is also expanding globally with products such as WAVE CONTROL MOSAIC^™*8, which includes color filter materials for image sensors.

Fujifilm continues to contribute to the development of the semiconductor industry through its advanced research and development capabilities. Providing one-stop solutions to solve customers' issues through its broad product lineup that covers key areas of the semiconductor manufacturing process, from leading-edge to legacy semiconductors, Fujifilm leverages its stable global supply chain with manufacturing locations in Japan, the United States, Europe, and Asia. 

• *1 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing.
• *2 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.
• *3 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *4 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *5 Materials for forming low-dielectric insulation films.
• *6 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer.
• *7 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.
• *8 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.

• * Please note that the contents including the product availability, specification, prices and contacts in this website are current as of the date of the press announcement and may be subject to change without prior notice.